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Your search returned 7 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
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Year : 2002 Volume number : 25 Issue: 01 |
The Effect Of Prebonding Heat Treatment On The Separability Of Au Wire From Ag-Plated Cu Alloy Substrate
(Article)
Subject:
Au
,
Cu Alloy
,
Cu Oxide Film
,
Separation
Author:
M.
Ondera
Toshiharu
Sugawara
page:
05
-
12
Optimal Design For A Ball Grid Array Wire Bonding Process Using A Neuro-Genetic Approach
(Article)
Subject:
Ball Grid Array
,
Exponential Stability
,
Genetic Algorithm
,
Wire Bonding
Author:
Chao-Ton
Su
Tai-Lin
Chiang
page:
13
-
25
Fine-Line Conductor Manufacturing Using Drop-On-Demand Pzt Printing Technology
(Article)
Subject:
Droplet Impact
,
Circuit Interconnects
Author:
John B.
Szcech
M
Megaridis
Daniel R.
Gamota
page:
26
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33
Modeling And Analysis Of S-D Solenoid Embedded Inductors
(Article)
Subject:
Low Temperatures
,
Embedded Passives
Author:
S.
Lee
page:
34
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41
Critical Issues Of Wafer Level Chip Scale Package (Wlcsp) With Emphasis On Cost Analysis And Solder Joint Reliability
(Article)
Subject:
Cost
,
Flip Chi P
,
Solder Joint Reliability
Author:
J
Lau
page:
42
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50
Modeling And Analysis Of 96.5sn-3.5ag Lead-Free Solder Joints Of Wafer Level Chio Scale Package On Buildup Microvia Printed Circuits Board
(Article)
Subject:
Lead-Free Solder
,
Microvia
,
Pcb
,
Reliability
Author:
J
Lau
Ricky
Lee
page:
51
-
58
Complex Cermic-Polymer Composite Microparts Made By Microstereolithography
(Article)
Subject:
Acrylate
,
Alumina Fibers
,
Ceramics
Author:
C.
Provin
S.
Monneet
page:
59
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70
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